Actively cooled anode for current-carrying component

ABSTRACT

An improved anode for an electronic component, such as used in circuitry having high power requirements wherein the anode requires some external coolant to pass therethrough to keep it from deteriorating due to heat energy absorbed thereby due to electrons bombarding the same. The anode includes platelet structure defining a working face which receives electrons from an emitter, such as a cathode. The platelet structure is formed with a coolant passage of relatively small dimensions to permit a coolant to pass continuously therewithin and in proximity to the working face to absorb and dissipate heat energy developed at the same in an efficient, rapid manner to minimize the build-up of heat energy in the structure itself due to induction therethrough. A number of platelet units can be provided with each platelet being secured to a base defining a manifold adapted to be coupled to a source of coolant under pressure. Each platelet structure can comprise at least a pair of plates of relatively thin wall thickness bonded together and having grooves or openings etched or otherwise formed therein to present the coolant passage therethrough with adjacent outer faces of the plates defining portions of the working face of the anode.

United States Patent Addoms et al.

[4 1 Oct. 29, 1974 ACTIVELY COOLED ANODE FOR CURRENT-CARRYING COMPONENT[75] Inventors: John F. Addorns, Rocklin, Calif;

Donald W. Culver, Richland, Wash.

[73] Assignee: Aerojet General Corporation, El Monte, Calif.

[22] Filed: Aug. 1, 1973 [21] Appl. No; 384,647

[52) U.S. Cl. 313/32, 315/538 [5 1] Int. Cl. HOlj 7/24 [58] Field ofSearch 313/32; 315/538 [56] References Cited UNITED STATES PATENTS3,098,165 7/1963 Zitelli 3l3/32 Primary Examiner-Herman Karl SaalbachAssistant ExaminerDarwin R. Hostetter Attorney. Agent, or Firm-John L.McGannon; John S. Bell [57] ABSTRACT An improved anode for an electroniccomponent,

such as used in circuitry having high power requirements wherein theanode requires some external coolant to pass therethrough to keep itfrom deteriorating due to heat energy absorbed thereby due to electronsbombarding the same. The anode includes platelet structure defining aworking face which receives electrons from an emitter, such as acathode. The platelet structure is formed with a coolant passage ofrelatively small dimensions to permit a coolant to pass continuouslytherewithin and in proximity to the working face to absorb and dissipateheat energy developed at the same in an efficient, rapid manner tominimize the build-up of heat energy in the structure itself due toinduction therethrough. A number of platelet units can be provided witheach platelet being secured to a base defining a manifold adapted to becoupled to a source of coolant under pressure. Each platelet structurecan comprise at least a pair of plates of relatively thin wall thicknessbonded together and having grooves or openings etched or otherwiseformed therein to present the coolant passage therethrough with adjacentouter faces of the plates defining portions of the working face of theanode.

26 Claims, 14 Drawing Figures W S Ci ll i- .i' 5 60 h x f I 46 2s 266 Rl 3' y 26b PT 2X66 D i ACTIVELY COOLED ANODE FOR CURRENT-CARRYINGCOMPONENT This invention relates to improvements in electronic circuitrycomponents and, more particularly, to an anode for a circuit component,such as a vacuum tube, having improved means for cooling the same whenit is in use.

BACKGROUND OF THE INVENTION Radar devices require vacuum tubes called,at least in some cases. crossed field amplifiers. These devices operatein a pulsed mode. During a pulse, electron energy incidence upon theanode is very large as the range of the entire device depends upon thestrength of the pulse. A great amount of thermal energy is absorbed bythe anode during a pulse; however, the pulses are of such short durationthat the anode is not melted by the thermal energy released from asingle pulse. For devices having a low duty cycle, e.g., 0.1% on" time,the working surface of the anode can be adequately cooled by the use ofhigh melting point surface materials and high conductivity backupmaterials. The more useful tubes, however, have a much more stringentduty cycle, on the order of l.0% on time which means that the anodereceives pulse energy input l% of the time. Under these conditions, theanode working surface requires active cooling.

Low frequency tubes have been successfully cooled with water or otherfluids of high velocity so that the required peak power and largerpercentage duty cycle, i.e., high average power level, is obtained. Theanode design affects the frequency of the tube. Low frequency tubes makeuse of an assembly of rather large individual vanes, separated by arather large uniform spacing. Such large components can be cooledinternally with normal methods, e.g., water cooled tubing and the like.Tubes which operate at higher frequencies (X band and higher) arecharacterized by much smaller anodc components. No method of internallycooling them presently exists. Thus, high average power, high frequency,crossed field amplifier tubes are not now available or not now beingbuilt. To accommodate such tubes, coolant passages must be provided nearthe heated anode working surface to carry off the heat energy developedat such location by the bombardment ofelectrons on the same, It is alsodesired that the relatively small size of the anode be sufficient forthe Ku band radar. yet still be cooled sufficiently to preventstructural deterioration or other damage due to thermal stresses imposedby the energy developed by the electron stream striking the workingsurface of the anode during a duty cycle. A need has, therefore, arisenfor an improved anode having cooling means which allows relatively smalldimensions to be utilized in those radar devices for high frequency,high power requirements.

SUMMARY OF THE lNVENTlON The present invention is directed to animproved anode which satisfies the aforesaid need in that it prescnts Llworking surface of relatively small dimensions and fluid passage meansof relatively small dimensions for directing a coolant into proximitywith the working surface. In this way, the coolant can be activelypassed in extremely close proximity to the working surface to absorb andcarry off excess thermal energy due to the bombardment of electrons onthe working surface during the duty cycle of the anode, therebypreventing build-up of thermal stresses which would otherwise damage andcause deterioration of the anode structure itself.

The invention utilizes a series of thin-walled plates bonded together toform a unit which is relatively thin in construction yet the unit has acoolant passage of relatively small cross-sectional area which extendsvery close to the working surface of the anode. This can be accomplishedbecause the passages are etched or machined into the plates before thesame are bonded to gether so that, upon being assembled, the passagesare at the precise locations desired to absorb the thermal energy yetthe platelet assembly itself is of sufficient strength to sustainitselfover many hours of actual use.

For purposes of illustration, the anode is comprised of threeside-byside platelet units, each unit being formed of a central platehaving a fluid passage etched therethrough and a pair of end plateswhich are bonded to opposed faces of the central plate to close thesides of the passage and to form with the central plate three end faceportions defining the working surface against which electrons impingewhen the anode is in use. The base sections of the three platelet unitsform parts of a coolant manifold and the platelet units are separatedfrom each other by suitable spacers also forming parts of the manifold.When coupled to a source of coolant, the coolant flows into themanifold, through the passages in the three platelet units, then out ofthe manifold, back to the coolant source. The coolant volume rate offlow can be selected to achieve the desired cooling capacity yet thestructural integrity of the platelet units remains intactnotwithstanding the relatively high frequency, high power electronstream bombarding the working surface of the anode during a duty cycle.

Several different embodiments of the working surface can be utilized. Inone embodiment, the anode working surface is formed by the workingsurface portions of the platelet units when the same are parallel witheach other. In another embodiment, the platelet units are arranged in anangular array so that the effec tive anode working surface is circularor is at least curved. Other configurations can be utilized where usagedictates particular requirements.

The primary object of this invention is to provide an improved anode fora current-carrying electronic component wherein the anode has a workingsurface for receiving electron current in an internal fluid passage ofrelatively small dimensions and in extremely close proximity to suchworking surface to absorb and carry off the thermal energy developed atthe same by the electron bombardment thereon so that the anode can beused where high power, high frequency parameters are required, such asin radar devices Another object of this invention is to provide animproved anode of the type described wherein the anode working surfaceis defined by end face segments of a group of platelet units arrangedside-byside and coupled at their bases to a manifold wherein eachplatelet unit has a fluid passage formed therein in proximity to its endface segment to permit delivery of coolant as closely as possible to thesame to dissipate the heat energy developed at such end face segment.

Still another object of this invention is to provide an anode of theaforesaid character wherein each platelet unit thereof is comprised of agroup of stacked plates with at least one of the plates being etched toform a finely dimensioned fluid passage therethrough with the passageextending along and in extremely close proximity to the end face segmentthereof so that a high velocity coolant can be directed through thepassage and dissipate the energy developed directly adjacent thereto atthe working surface portion thereof.

Other objects of this invention will become apparent as the followingspecification progresses, reference being had to the accompanyingdrawings for illustrations of several embodiments of the invention Inthe drawings:

FIG. I is a perspective view of one embodiment of the anode of thisinvention;

FIG. 2 is an elevational view, partly in section, of the anode of FIG.1, showing the three platelet units thereof in end elevation;

FIG. 3 is an elevational view of the anode showing a platelet unit inside elevation;

FIG. 4 is an enlarged, side elevational view of one of the three platesforming a platelet unit of the anode;

FIG. 4a is an enlarged, end elevational view of a platelet unit, showingthe three plates forming the same;

FIG. 5 is a view similar to FIG. 4 but showing another plate of theplatelet unit;

FIG. 6 is an exploded view of the parts used to form the anode of FIG.1',

FIG. 7 is a view similar to FIG. I but showing another embodiment of theanode with the platelet units thereof arranged in a circular array; and

FIGS. Sci-8f are enlarged, fragmentary crosssectional views of otherplatelet units. showing variations in the way in which the fluidpassages thereof can be formed.

The first embodiment of the anode of this invention is denoted by thenumeral 10 and is shown in FIG. I. Anode 10 utilizes a base 12 and anumber of platelet units 14 which are in electrically-coupledrelationship to base 12 and extend laterally from one face 16 thereof.Each unit 14 has an outer, rectilinear. rela tively narrow surface 18which defines a portion of the working face of the anode. i.e., the faceagainst which an electron current impinges during operation of thecomponent of which the anode forms a part.

Anode I0 is adapted to be mounted in an envelope or housing and formsone portion of an electrical circuit which includes an electron emitterin the housing and spaced from surfaces 18 of units 14. Thus, when apotential difference is established between the emitter and anode I0.electron current will flow to the anode and will strike surfaces 18 andllow through units 14, base 12, and in the external circuit.

Anode I0 is adapted to be used in components which operate at relativelyhigh frequencies (X band and higher) and. as such, the anode isrelatively small in dimensions. Because of the current which flows therethrough. anode I0 is heated to an appreciable degree when used at highfrequencies. and the heat energy absorbed by the anode is sufficient torequire cooling of it to prevent damage due to thermal stresses. To thisend, a coolant. such as water is caused to flow under pressure into base12 through a first port 20 in one side face 21, then into and through afluid passage in each platelet unit 14, and then out of the base throughanother port 22 (FIG. 3] in the opposite side face 23.

Ports 20 and 22 are adapted to be coupled in some suitable manner to asuitable coolant source. Thus. the water or other coolant can be forcedthrough the anode at a predetermined volume rate of flow. therebymaintaining the anode sufficiently cool during its duty cycle which, inthe case of high frequency, high power radar tubes. can be of the orderof 1%.

The platelet units 14 are substantially identical in construction. Eachunit 14 includes a pair of flat end plates 24, one of which is shown inFIG. 5, and a flat central plate 26 shown in FIG. 4. Each plate 24 has abase section 28 provided with two circular holes 30 and 32 therethrough,and a second or vane section 34 integral with and projecting laterallyfrom a marginal edge 36 of base section 28. Each second section 34 has apair of recesses 38 therein which, for purposes of illustration, are foraccommodating adjacent structure of the component of which anode 10forms a part. Each section 38 has an outer, substantially flat end face40 which defines a part of the current-receiving surface portion 18 ofthe platelet unit 14 of which end plate 24 forms a part.

Central plate 26 has a base section 42 substantially identical in sizeto base section 28 of each end plate 24.

Section 42 has a pair of holes 44 and 46 aligned with holes 30 and 32 ofboth end plates 24, respectively, when the corresponding unit 14 isassembled. When so aligned, holes 30 and 44 are adapted to receive acoolant from the coolant source through port 20. and holes 32 and 46communicate with port 22 for return of the coolant to the source.

Central plate 26 has a second section 48 integral with and projectingfrom base section 42 and of the same size and shape as second section 34of each end plate 24. Section 48 has an outer end face 50 which mateswith end faces 40 of end plates 24 to form the currentreceiving workingsurface 18 of the corresponding platelet unit 14.

Central plate 26 has etched therethrough a fluid passage broadly denotedby the numeral 52 which interconnects holes 44 and 46 in the mannershown in FIG. 4. Passage 52 has two segments 53 and 55 which extend awayfrom holes 44 and 46 and converge as they approach end face 50. Then,near an imaginary line 61 perpendicular to a center line 54 of plate 26,segments 53 and S5 diverge, become smaller in cross section, andterminate at respective ends of an end segment 58 which is in extremelyclose proximity to end face 50. Thus. the coolant entering hole 44 flowssuccessively into and through segments 53. 58 and 5S and out of plate 26through hole 46.

To assemble each platelet unit 14, the two end plates 24 and centralplate 26 thereof are bonded together to form a sandwich construction asshown in FIG. 4a. The bond can be made in any suitable manner. such asby diffusion bonding.

In assembling anodc 10, three units 14 are stacked with other parts in amanner shown, for purposes of illustration. in the exploded view of FIG.6. Such other parts include a number of spacers 62 and a pair of endbase plates 66 and 68. There is a spacer 62 between each pair ofadjacent platelet units 14, and a spacer 62 near the outer face of eachend platelet unit 14. Each spacer 62 has the same size and shape assection 28 of each end plate 24 and has two holes 64 and 65 (FIG. 6)therethrough for alignment with ports 20 and 22, respectively. End baseplate 66 with inlet port 20 is at one end of the assembly and end baseplate 68 having exit port 22 is at the opposite end of the assembly.

All of the parts shown in FIG. 6 will be bonded together to form anodeso that it will have the configuration shown in FIG. 1. When soassembled, the anode will be ready for use.

In use. the anode will be placed in a housing along with an emitter.such as a cathode. the housing being evacuated if the component to beformed is a vacuum tube. When a potential difference is applied acrossthe anode and cathode, with the cathode negative with respect to theanode. current will flow to the anode. specifically to the workingsurfaces 18 thereof. However. during this time. a coolant. such aswater. will flow through the platelet units and cool the same anddissipate the heat generated in the anode due to the bombardment ofelectrons on working surfaces 18. The coolant will enter anode 10through port 20, will flow through each platelet unit [4 by flowingthrough passage 52 thereof. and will exit from the anode through port22. The heat generated in the anode will then be carried off to thecoolant source.

Segment S8 of central plate 26 can be etched therethrough so that it isspaced by a distance of approximately 0030 inch from end face 50thereof. This distance is denoted by the letter din FIG. 4. Thisdistance is relatively small with respect to the length and width ofeachvane section 34. Thus. plate 26 must be etched to obtain the relativelysmall cross-sectional area of the fluid passage through thecorresponding unit 14.

Certain dimensions ofanode 10 are critical as to certain frequency bandsofoperation. The relatively small sin: of the anode is dictated byresonant frequency response requirements in these bands. The designdimensions in inches for a three platelet unit anode and thecorresponding tolerances are given for the following two bands:

X Band K Band Tolerance Pitch is defined as the center lineto-centerline distance between each pair of adjacent platelet units 14.

The anode. while being described above as comprised ofthree plateletunits 14, is practical for use with approximately ll0 such plateletunits 14. in using such a relatively large number, care must be taken toassure that the tolerances do not exceed prescribed limits forparticular bands.

Other typical dimensions include the following: segment 58 of eachplatelet unit 14 is approximately .006 inch (denoted by the letter S");the width ofsegments 53 and 55 is approximately .018 inch (denoted bythe letter .X"); segments 53 and 55 tapering progressively smaller asthey approach the corresponding ends of segment 58. and at such ends.the width of the segments is approximately 0.009 inch (denoted by thenumeral 7.). the radius of each hole 44 and 46 is 0.080 inch l denotedby the letter R); the central axes of the holes 44 and 46 being spacedinwardly from adjacent end margins 26a and 26b of base section 42 by adistance of approximately 0.175 inch (denoted by the let tcr D); thedistance of the central axes of holes 44 and 46 with respect to sidemargin 26c being also approximately 0.175 inch (denoted by the letterH); and the height of base section 42 is approximately 0.350 inch(denoted by the letter J).

In designing the anode, freedom of design is restricted by variousoperating and fabrication considerations. If the anode is to form acomponent ofa vacuum tube. this requirement limits the material and thebrazing alloy selections in the case of brazing the platelets together.The resonant frequency response requirements results in extremely tighttolerance limits. Available coolant quantity and pressure restricts thethermal design. Anode assembly procedures require that the anode becapable of several future braze cycles. The materials used in making theanode must conform to the following: they must be non-magnetic; thematerial must have a high surface conductivity; and the material musthave a high melting point.

Typical process requirements are as follows: the maximum coolant volumerate of flow should be approximately 0.0l9 gpm for each platelet unit14; the maximum coolant inlet pressure should be approximately 500 psia;the average power dissipation is approximately 60 watts for eachplatelet unit 14; and the life of the anode should be thousands ofhours. typically of the order of IO thermal cycles.

ln the selection of materials, silver. copper or aluminum can be used.The requirement for a material that can withstand 1.000C. duringfabrication steps elimi nates aluminum and silver. and copper is mostpreferred over any other material. OFHC copper was selected over thehigher strength zirconium copper because the latter material breaks downwhen heated over l.750F.

For thermal design limits. such limits were based on of burnout heatflux. assuming 400 psia minimum pressure in the coolant passage, waterbeing the coolant. and a maximum water temperature of lOOF. andone-dimensional cooling. The required coolant velocity was calculated asa function of the thickness of each platelet unit l4. approximately0.0l6 inch. Essentially. the thicker the wall. the less area isavailable for removal of heat. The average heat flux over the area ofthe working face of each platelet unit. ie. 60 watts/unit. isapproximately [4.2 BTU/sec-in". The required coolant velocity for thisis typically 42.5 feet per sec ond. The velocity increase required forvarious wall thicknesses is proportional to reduction in area. Thus.ifthe main wall thickness is 0.004 inch, the area available for removalof heat is reduced from 0.0l6 inch to 0.008 inch and the requiredvelocity doubles or increases to feet per second.

In the mechanical design of the coolant passages through the plateletunits. such design is established by the thermal design and the etchfactor requirements for platelet fabrication. In general. for good.reproducible parts. the passage etch width must be at least three timesthe depth of the passage. This etch factor influences the passage area.depending upon the number of platelets and the type of etch. whetherthrough etch or depth etch. t

FlGS. 8a through Sfshow passage cross sections of several proposeddesigns. In FlG, 8a, two mirror image. depth etch platelets 80 arejoined to form the coolant passage segment 58. (FlG. 8b shows athrough-etched platelet 82 backed by two unetched cover plates 84 toform segment 58.). The design of FIG. 8b is the one above with respectto anode 10. In FIG. 8c, the segment is formed from a combination of thedesigns of FIGS. 8a and 8b. FIGS. 8d. 8e and 8f are variations possiblefor the formation of two parallel segments 58. FIG. 8d shows a centralplate 86 partially etched on both sides and disposed between a pair offlat cover plates 84; FIG. 80 shows a central plate 86 disposed betweena pair of partially etched cover plates 80'. and FIG. 8f shows a flatcentral plate 88 between a pair of etched cover plates 80. segment 58 ofeach of the designs of FIGS. 80 through 8f has a minimum cross-sectionalarea a function of wall thickness and etch ratio.

Anode IO has been described as having the three platelet units 14substantially parallel with each other. In another embodiment. anode 110shown in FIG. 7 has the three platelet units [I4 thereof which areinclined with respect to each other. They are made in essentially thesame way as that described above with respect to anode except that thethree platelet units 114 are separated from each other by a taperedspacer plate 162. Coolant flows through the platelet units H4 in thesame way as that described above with respect to platelet units I4.Also. there could be a plurality of angularly disposed platelet units114 forming an array which surrounds a central area in which theelectron emitter is placed.

We claim:

I. An anode for a current-carrying electronic component comprising: anassembly comprised of a plurality of plates bonded together in a stackto form an external. current-receiving working surface and an internalfluid passage having a segment in proximity to said working surface. thethickness of the assembly being a number oftimes less than the lengthofthe working surface. and means defining a fluid manifold coupled tothe assembly in fluid communication with said fluid passage. saidmanifold adapted to be coupled to a source of a coolant under pressureso that the coolant can be directed into the passage and through saidsegment and thereby into substantial heat exchange relationship to saidworking surface.

2. An anode as set forth in claim I, wherein said segment extendslongitudinally of said working surface with the distance therebetweenbeing a number of times less than the length of said working surface.

3. An anode as set forth in claim 2, wherein the ratio ofsaid length tosaid distance is approximately 8.33311 for the X frequency band.

4. An anode as set forth in claim 2, wherein the cross- .sectional areaof said segment is approximately Z4Xlll inches.

5. An anode as set forth in claim I. wherein the ratio of said length tosaid thickness is approximately lfititilzl for the X frequency band.

6. An anode as set forth in claim I. wherein the ratio of said length tosaid thickness is approximately :1 for the Kpt frequency bandv 7. Ananode as set forth in claim I, wherein said assembly includes a centralplate having said passage through-etched therein and a pair of endplates bonded to rcspcctnc sides otihe central plate to close the sidesof the passage 8. An anode as set forth in claim I, wherein the as- SCmll) includes a pair of plates. each plate having an inner surfaceprovided with a groove therein. the grooves being in mating relationshipwith each other to form said passage.

(iii

9. An anode as set forth in claim 1, wherein the assembly includes apair of end plates and a central plate between the end plates, thecentral plate having a groove in each face thereof, respectively, thegrooves defining a pair of side-by-side fluid passages in fluidcommunication with said manifold.

It). An anode assembly as set forth in claim I. wherein the assemblyincludes a pair of end plates and a central plate between the endplates. each end plate having a groove on its inner surface. the groovesdefining a pair of side-byside fluid passages in fluid communicationwith said manifold.

II. An anode as set forth in claim 1. wherein the passage decreases inwidth as it approaches the segment.

I2. An anode as set forth in claim I, wherein the seg' ment issubstantially parallel to said working surface.

I3. An anode as set forth in claim I. wherein each plate has a basesection and a vane section integral with the base section. the latterhaving a pair of spaced holes therethrough. said passage communicatingwith the holes and extending into the vane section. said base sectiondefining a part of said manifold means.

14. An anode as set forth in claim I, wherein the length of each vanesection is a number of times greater than said thickness.

15. An anode as set forth in claim 14, wherein the ratio of said vanesection length to said thickness is approximately 2l.25:l for the Xfrequency band.

16. An anode as set forth in claim 14, wherein the ratio of said vanesection length to said thickness is approximately l9:l for the Kp.frequency band.

I7. An anode for a current-carrying electronic component comprising: anarray of spaced. elongated. elec trically conductive vanes. each vanebeing comprised of an assembly of plates coupled together in a stack toform an external. curent-receiving working surface extending across itswidth at one end thereof. the plates of each vane having means definingan internal fluid passage provided with a segment in proximity to theadjacent working surface. the thickness of each assembly being a numberof times less than said width. the working surfaces of said vanes beingin aligned, side-by-side relationship to each other; and means defininga fluid manifold for delivering fluid to said passages. said vanes beingcoupled to the manifold means with said passages in fluid communicationtherewith. said manifold means adapted to be coupled to a source of afluid under pressure so that the fluid can be directed into the passagesand through respective segments in heat exchange relationship toadjacent working surfaces.

18. An anode as set forth in claim I7. wherein each segment extendslongitudinally ofthe adjacent working surface with the distancetherebetween being a number of times less than said width.

19. An anode as set forth in claim I7. wherein the pitch of the vanes isa number of times less than the length of each vane.

20. An anode as set forth in claim 17. wherein said width is of theorder of magnitude of the length of the corresponding vane.

21. An anode as set forth in claim [7, wherein the vanes are angularlydisposed relative to each other and converge toward each other as theworking surfaces thereof are approached.

22. An anode as set forth in claim [7. wherein the vanes are parallelwith each other.

23. An anode as set forth in claim 17, wherein the vanes aresubstantially identical to each other in length, width and thickness andare uniformly spaced apart.

24. An anode for a current-carrying electronic component comprising: anarray of elongated, electrically conductive vanes, the vanes beinguniformly spaced apart to provide a predetermined pitch for said array,each vane having a length and width and being comprised of an assemblyof plates coupled together in a stack to form an external,currenbreceiving working surface extending across its width at one endthereof, the plates of each vane having means defining an internal fluidpassage provided with a segment in proximity to the adjacent workingsurface, the thickness of each assembly and said pitch being a number oftimes less than said width, said length being of the order of magnitudeof said width, said pitch being greater than said thickness, the workingsurfaces of said vanes being in aligned, side-by-side relationship toeach other; and means defining a fluid manifold for delivering fluid tosaid passages, said vanes being coupled to the manifold means with saidpassages in fluid communication therewith, said manifold means adaptedto be coupled to a source of a fluid under pressure so that the fluidcan be directed into the passages and through respective segments inheat exchange relationship to adjacent working surfaces.

25. An anode as set forth in claim 24, wherein said thickness, saidlength, said width and said pitch, when said array is adapted for usewith the X frequency band, are as follows:

Thickness ,tllb inch Length .340 inch Width .250 inch Pitch ,(lJZ inch26. An anode as set forth in claim 24, wherein said thickness, saidlength, said width and said pitch. when said array is adapted for usewith the Ku frequency band, are as follows:

Thickness .UlU inch Length ,l inch Width ,200 inch Pitch ,Ol8 inch

1. An anode for a current-carrying electronic component comprising: anassembly comprised of a plurality of plates bonded together in a stackto form an external, current-receiving working surface and an internAlfluid passage having a segment in proximity to said working surface, thethickness of the assembly being a number of times less than the lengthof the working surface; and means defining a fluid manifold coupled tothe assembly in fluid communication with said fluid passage, saidmanifold adapted to be coupled to a source of a coolant under pressureso that the coolant can be directed into the passage and through saidsegment and thereby into substantial heat exchange relationship to saidworking surface.
 2. An anode as set forth in claim 1, wherein saidsegment extends longitudinally of said working surface with the distancetherebetween being a number of times less than the length of saidworking surface.
 3. An anode as set forth in claim 2, wherein the ratioof said length to said distance is approximately 8.333:1 for the Xfrequency band.
 4. An anode as set forth in claim 2, wherein thecross-sectional area of said segment is approximately 24 X 10 6 inches.5. An anode as set forth in claim 1, wherein the ratio of said length tosaid thickness is approximately 15.667:1 for the X frequency band.
 6. Ananode as set forth in claim 1, wherein the ratio of said length to saidthickness is approximately 20:1 for the K Mu frequency band.
 7. An anodeas set forth in claim 1, wherein said assembly includes a central platehaving said passage through-etched therein and a pair of end platesbonded to respective sides of the central plate to close the sides ofthe passage.
 8. An anode as set forth in claim 1, wherein the assemblyincludes a pair of plates, each plate having an inner surface providedwith a groove therein, the grooves being in mating relationship witheach other to form said passage.
 9. An anode as set forth in claim 1,wherein the assembly includes a pair of end plates and a central platebetween the end plates, the central plate having a groove in each facethereof, respectively, the grooves defining a pair of side-by-side fluidpassages in fluid communication with said manifold.
 10. An anodeassembly as set forth in claim 1, wherein the assembly includes a pairof end plates and a central plate between the end plates, each end platehaving a groove on its inner surface, the grooves defining a pair ofside-by-side fluid passages in fluid communication with said manifold.11. An anode as set forth in claim 1, wherein the passage decreases inwidth as it approaches the segment.
 12. An anode as set forth in claim1, wherein the segment is substantially parallel to said workingsurface.
 13. An anode as set forth in claim 1, wherein each plate has abase section and a vane section integral with the base section, thelatter having a pair of spaced holes therethrough, said passagecommunicating with the holes and extending into the vane section, saidbase section defining a part of said manifold means.
 14. An anode as setforth in claim 1, wherein the length of each vane section is a number oftimes greater than said thickness.
 15. An anode as set forth in claim14, wherein the ratio of said vane section length to said thickness isapproximately 21.25:1 for the X frequency band.
 16. An anode as setforth in claim 14, wherein the ratio of said vane section length to saidthickness is approximately 19:1 for the K Mu frequency band.
 17. Ananode for a current-carrying electronic component comprising: an arrayof spaced, elongated, electrically conductive vanes, each vane beingcomprised of an assembly of plates coupled together in a stack to forman external, curent-receiving working surface extending across its widthat one end thereof, the plates of each vane having means defining aninternal fluid passage provided with a segment in proximity to theadjacent working surface, the thickness of each assembly being a numberof times less than said width, the working surfaces of said vanes beingin aligned, side-by-side relationship to each other; and meAns defininga fluid manifold for delivering fluid to said passages, said vanes beingcoupled to the manifold means with said passages in fluid communicationtherewith, said manifold means adapted to be coupled to a source of afluid under pressure so that the fluid can be directed into the passagesand through respective segments in heat exchange relationship toadjacent working surfaces.
 18. An anode as set forth in claim 17,wherein each segment extends longitudinally of the adjacent workingsurface with the distance therebetween being a number of times less thansaid width.
 19. An anode as set forth in claim 17, wherein the pitch ofthe vanes is a number of times less than the length of each vane.
 20. Ananode as set forth in claim 17, wherein said width is of the order ofmagnitude of the length of the corresponding vane.
 21. An anode as setforth in claim 17, wherein the vanes are angularly disposed relative toeach other and converge toward each other as the working surfacesthereof are approached.
 22. An anode as set forth in claim 17, whereinthe vanes are parallel with each other.
 23. An anode as set forth inclaim 17, wherein the vanes are substantially identical to each other inlength, width and thickness and are uniformly spaced apart.
 24. An anodefor a current-carrying electronic component comprising: an array ofelongated, electrically conductive vanes, the vanes being uniformlyspaced apart to provide a predetermined pitch for said array, each vanehaving a length and width and being comprised of an assembly of platescoupled together in a stack to form an external, current-receivingworking surface extending across its width at one end thereof, theplates of each vane having means defining an internal fluid passageprovided with a segment in proximity to the adjacent working surface,the thickness of each assembly and said pitch being a number of timesless than said width, said length being of the order of magnitude ofsaid width, said pitch being greater than said thickness, the workingsurfaces of said vanes being in aligned, side-by-side relationship toeach other; and means defining a fluid manifold for delivering fluid tosaid passages, said vanes being coupled to the manifold means with saidpassages in fluid communication therewith, said manifold means adaptedto be coupled to a source of a fluid under pressure so that the fluidcan be directed into the passages and through respective segments inheat exchange relationship to adjacent working surfaces.
 25. An anode asset forth in claim 24, wherein said thickness, said length, said widthand said pitch, when said array is adapted for use with the X frequencyband, are as follows:
 26. An anode as set forth in claim 24, whereinsaid thickness, said length, said width and said pitch, when said arrayis adapted for use with the K Mu frequency band, are as follows: